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Kwang-Jae Shin

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Wafer Level Package Using Glass Cap and Wafer with Groove-Shaped Via

2007 The Transactions of the Korean Institute of Electrical Engineers
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NewlyDeveloped HighQ FBAR withMesa-Shaped Membrane

2006 European Microwave Conference
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Newly Developed High Q FBAR with Mesa-Shaped Membrane

2006 EuMC | European Microwave Conference
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