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Seiji Muranaka

Renesas Electronics

6

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56

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Study on Cone-defects during the Pattern Fabrication Process with Silicon Nitride

2015 Journal of Photopolymer Science and Technology
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The effect of crystal phase of Ta barrier on via resistance and reliability performance for Cu line

2014 IITC | International Interconnect Technology Conference
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Suppression of Stress-Induced Voiding by Controlling Microstructure of Cu Electroplated Films

2013 Japanese Journal of Applied Physics
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Extremely Low Keff (1.9) Cu Interconnects with Air Gap Formed Using SiOC

2007 IITC | International Interconnect Technology Conference
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Impact of Organic Contaminants from the Environment on Electrical Characteristics of Thin Gate Oxides

1998 Japanese Journal of Applied Physics
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Citations (43)