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A. Ishii

Renesas Electronics

4

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Extremely Low Keff (1.9) Cu Interconnects with Air Gap Formed Using SiOC

2007 IITC | International Interconnect Technology Conference
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CuAl Alloy Interconnects as a Solution to the Trade-off between Reliability and Defect Density

2006 The Japan Society of Applied Physics
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Interface engineering for highly-reliable 65 nm-node Cu/ULK (k=2.6) interconnect integration

2005 IITC | International Interconnect Technology Conference
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Citations (1)