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David Jayez
David Jayez
GlobalFoundries
Metrology
Electronic engineering
Engineering
Wafer
Computer science
5
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1
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0
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Yield impact for wafer shape misregistration-based binning for overlay APC diagnostic enhancement
2018
David Jayez
Kevin Jock
Yue Zhou
Venugopal Govindarajulu
Zhen Zhang
Fatima Anis
Felipe Tijiwa-Birk
Shivam Agarwal
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Wafer backside cleaning for defect reduction and litho hot spots mitigation: DI: Defect inspection and reduction
2018
ASMC | Advanced Semiconductor Manufacturing Conference
Elango Balu
Wei-Tsu Tseng
David Jayez
Jay Mody
Keith Donegan
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Metrology manufacturing control factors: A holistic approach for supporting 14nm and 7nm
2017
ASMC | Advanced Semiconductor Manufacturing Conference
David Jayez
Alok Vaid
Eric P. Solecky
Michael Lenahan
Dhairya Dixit
Charles Largo
Georgios Vakas
Steve Seipp
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Metrology manufacturing control factors: A holistic approach for supporting 14nm and 7nm
2017
MIPRO | International Convention on Information and Communication Technology, Electronics and Microelectronics
David Jayez
Alok Vaid
Eric Solecky
Michael Lenahan
Dhairya Dixit
Charles Largo
Georgios Vakas
Steve Seipp
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Manufacturing excellence using multi-platform ellipsometry thickness measurement fleet on advanced nodes
2016
ASMC | Advanced Semiconductor Manufacturing Conference
Michael Lenahan
Alok Vaid
Sridhar Mahendrakar
Steven Seipp
David Jayez
Alice Yueh
Shweta Saxena
Eric P. Solecky
Samuel Gizzi
Amir Heller
Tianhao Zhang
Da Song
Nam Hee Yoon
Janay Camp
Kartik Venkataraman
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