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Sébastien Lagrange

Katholieke Universiteit Leuven

6

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216

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A controlled deposition of organic contamination and the removal with ozone

2000
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TOFSIMS evaluation of the removal of resists on silicon by ozone-based cleaning

2000
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Roles of additives during filling process of damascene structures with electrochemical deposited copper

1999
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Two-step room temperature grain growth in electroplated copper

1999 Journal of Applied Physics
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Self-annealing characterization of electroplated copper films

1999 Microelectronic Engineering
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Citations (122)