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Sébastien Lagrange
Sébastien Lagrange
Katholieke Universiteit Leuven
Materials science
Copper
Metallurgy
Grain growth
Sheet resistance
6
Papers
216
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A controlled deposition of organic contamination and the removal with ozone
2000
Martine Claes
Stefan De Gendt
Conny Kenens
Thierry Conard
Hugo Bender
Wolfgang Storm
Sébastien Lagrange
Paul Mertens
Marc Heyns
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TOFSIMS evaluation of the removal of resists on silicon by ozone-based cleaning
2000
Thierry Conard
Conny Kenens
Stefan De Gendt
Martine Claes
Sébastien Lagrange
W WorthA
Wilfried Vandervorst
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Roles of additives during filling process of damascene structures with electrochemical deposited copper
1999
Emmanuel Richard
Iwan Vervoort
Sywert Brongersma
Gerald Beyer
Hugo Bender
Roger Palmans
Sébastien Lagrange
Karen Maex
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Two-step room temperature grain growth in electroplated copper
1999
Journal of Applied Physics
Sywert Brongersma
Emmanuel Richard
Iwan Vervoort
Hugo Bender
Wilfried Vandervorst
Sébastien Lagrange
Gerald Beyer
Karen Maex
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Citations (86)
Self-annealing characterization of electroplated copper films
1999
Microelectronic Engineering
Sébastien Lagrange
Sywert Brongersma
Moshe Judelewicz
Annelies Saerens
Iwan Vervoort
Emmanuel Richard
Roger Palmans
Karen Maex
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Citations (122)
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