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Meng Meng Chong
Meng Meng Chong
GlobalFoundries
Delamination
Materials science
Adhesion
Bending
Composite material
2
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3
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0
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Interfacial Adhesion Strength Characterization of SiCOH/TaN Stack by 4-Point-Bending
2018
IPFA | International Symposium on the Physical and Failure Analysis of Integrated Circuits
Xintong Zhu
Xiaoxuan Li
Ramesh Rao Nistala
Zhi-Qiang Mo
Meng Meng Chong
Xue Song Rao
Chim Seng Seet
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Four-Point Bending Methodology development for 40nm technology Cu/Nblk interface adhesion measurement
2015
IPFA | International Symposium on the Physical and Failure Analysis of Integrated Circuits
Yun Wang
Yanjing Yang
Meng Meng Chong
Ramesh Rao Nistala
X. S. Rao
Chim Seng Seet
Zhiqiang Mo
S. P. Zhao
J. Lam
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