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Hiroshi Kudo

Dai Nippon Printing

9

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34

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Effectiveness of Inorganic Dielectric Layer on Submicron-scale Cu Traces against Thermal Oxidative Stress

2021 ECTC | Electronic Components and Technology Conference
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Introduction of Sub-2-micron Cu traces to EnCoRe enhanced copper redistribution layers for heterogeneous chip integration

2018 ICEP | International Conference on Electronics Packaging
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Demonstration of high electromigration resistance of enhanced sub-2 micron-scale Cu redistribution layer for advanced fine-pitch packaging

2017 ICSJ | CPMT Symposium Japan
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Glass interposer for advanced packaging solution

2016 Electronics System-integration Technology Conference
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A Characterized Redistribution Layer Architecture for Advanced Packaging Technologies

2016 ECTC | Electronic Components and Technology Conference
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