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Timothy D. Sullivan

IBM

72

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Evaluating the Potential Impact of Smart Grid Funding on Reducing the Economic Impact of Large Outage Events in the United States from 2003 to 2017

2019
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A process to reduce the occurrence of metal extrusions in al interconnects

2013 ASMC | Advanced Semiconductor Manufacturing Conference
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Novel design and integration enhancements in the final polymeric passivation for improved mechanical performance and C4 electromigration in lead-free C4 products

2012 ECTC | Electronic Components and Technology Conference
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Statistical Evaluation of Electromigration Reliability at Chip Level

2011 IEEE Transactions on Device and Materials Reliability
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3D copper TSV integration, testing and reliability

2011 IEDM | International Electron Devices Meeting
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Reliability Wearout Mechanisms in Advanced CMOS Technologies

2009
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Stress‐Induced Voiding

2009
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Reliability challenges for advanced copper interconnects: Electromigration and time-dependent dielectric breakdown (TDDB)

2009 IPFA | International Symposium on the Physical and Failure Analysis of Integrated Circuits
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Dielectric Characterization and Reliability Methodology

2009
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Negative Bias Temperature Instabilities in pMOSFET Devices

2009
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Citations (12)