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Ekta Misra
Ekta Misra
IBM
Electronic engineering
Materials science
Chip
Integrated circuit
Dielectric
7
Papers
13
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0
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The projection of the incidence of dielectric cracking during chip joining with lead free solder bumps
2016
IRPS | International Reliability Physics Symposium
Timothy M. Shaw
X-H Liu
Ekta Misra
David L. Questad
Griselda Bonilla
Thomas A. Wassick
Hosadurga Shobha
K. Smith
Gordon C. Osborne
D. Kioussis
J. Wright
R. Bisson
I. Paquin
Mark C. H. Lamorey
S.S. Bouchard
S. Tetreault
David B. Stone
Christopher D. Muzzy
Brian R. Sundlof
Timothy H. Daubenspeck
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The strength of BEOL structures fabricated using low K materials and its impact on CPI failures
2015
IIRW | International Integrated Reliability Workshop
Timothy M. Shaw
X-H Liu
Ekta Misra
David L. Questad
Griselda Bonilla
Thomas A. Wassick
Mark C. H. Lamorey
Hosadurga Shobha
Gordon C. Osborne
D. Kioussis
J. Wright
R. Bisson
I. Paquin
S.S. Bouchard
S. Tetreault
David B. Stone
Christopher D. Muzzy
Brian R. Sundlof
Timothy H. Daubenspeck
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Citations (2)
FBEOL no-aluminum pad integration in Pb-free C4 products for environmental, cost and reliability benefits
2014
ECTC | Electronic Components and Technology Conference
Ekta Misra
Timothy H. Daubenspeck
Thomas A. Wassick
Krishna Tunga
David L. Questad
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Novel design and integration enhancements in the final polymeric passivation for improved mechanical performance and C4 electromigration in lead-free C4 products
2012
ECTC | Electronic Components and Technology Conference
Ekta Misra
Timothy H. Daubenspeck
Thomas A. Wassick
G. J. Scott
Krishna Tunga
Gary LaFontant
David L. Questad
G. Osborne
Timothy D. Sullivan
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Citations (5)
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