Old Web
English
Sign In
Acemap
>
authorDetail
>
Tang Gong Yue
Tang Gong Yue
UTAC Group
Electronic engineering
Through-silicon via
Materials science
Thermal conductivity
Thermal resistance
5
Papers
220
Citations
0.00
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (5)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
Comprehensive Study on the Encapsulation for the Intelligent Power Module
2019
EPTC | Electronics Packaging Technology Conference
Simon Siak Boon Lim
Eva Wai Leong Ching
Kazunori Yamamoto
Tang Gong Yue
Show All
Source
Cite
Save
Citations (0)
パワーエレクトロニクスパッケージのための高温endurableダイアタッチ材料プロセスへの挑戦【Powered by NICT】
2017
Wai Leong Ching
Ding Mian Zhi
Tang Gong Yue
Show All
Source
Cite
Save
Citations (0)
Effects of TSVs (through-silicon vias) on thermal performances of 3D IC integration system-in-package (SiP)
2012
Microelectronics Reliability
John H. Lau
Tang Gong Yue
Show All
Source
Cite
Save
Citations (61)
Effect of TSV interposer on the thermal performance of FCBGA package
2009
EPTC | Electronics Packaging Technology Conference
Yen Yi Germaine Hoe
Tang Gong Yue
Pinjala Damaruganath
Chai Tai Chong
John H. Lau
Zhang Xiaowu
Kripesh Vaidyanathan
Show All
Source
Cite
Save
Citations (31)
Thermal management of 3D IC integration with TSV (through silicon via)
2009
ECTC | Electronic Components and Technology Conference
John H. Lau
Tang Gong Yue
Show All
Source
Cite
Save
Citations (128)
1