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Christopher J. Penny

IBM

26

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Interconnect scaling challenges, and opportunities to enable system-level performance beyond 30 nm pitch

2020 IEDM | International Electron Devices Meeting
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Exploring the Limits of Cobalt Liner Thickness in Advanced Copper Interconnects

2019 IEEE Electron Device Letters
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Pinch-Off Plasma CVD Deposition Process and Material Technology for Nano-Device Air Gap/Spacer Formation

2018
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Pinch Off Plasma CVD Deposition Process and Material Technology for Nano-Device Air Gap/Spacer Formation

2018 ECS Journal of Solid State Science and Technology
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Through-Cobalt Self Forming Barrier (tCoSFB) for Cu/ULK BEOL: A novel concept for advanced technology nodes

2015 IEDM | International Electron Devices Meeting
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Performance of ultrathin alternative diffusion barrier metals for next - Generation BEOL technologies, and their effects on reliability

2014 IITC | International Interconnect Technology Conference
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ALD and PVD Tantalum Nitride Barrier Resistivity and Their Significance in via Resistance Trends

2014
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Microstructure Evolution of Copper in Nanoscale Interconnect Features

2014
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Electrodeposited Cu Film Morphology on Thin PVD Cu Seed Layers

2013 Journal of The Electrochemical Society
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Effect of Bath Chemistry On Electrodeposited Cu Morphology Using Thin PVD Cu Seed

2013
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