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T. Dretschkow
T. Dretschkow
Atotech
Composite material
Materials science
Copper
Aspect ratio (aeronautics)
Silicon
2
Papers
94
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Copper filling of TSVs for interposer applications
2012
EPTC | Electronics Packaging Technology Conference
N. Jürgensen
Q. H. Huynh
G. Engelmann
Ha-Duong Ngo
O. Ehrmann
Klaus-Dieter Lang
Albrecht Uhlig
T. Dretschkow
Dirk Rohde
O. Worm
Cornelia Jäger
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Citations (3)
High aspect ratio TSV copper filling with different seed layers
2008
ECTC | Electronic Components and Technology Conference
M. J. Wolf
T. Dretschkow
B. Wunderle
N. Jürgensen
G. Engelmann
O. Ehrmann
Albrecht Uhlig
B. Michel
Herbert Reichl
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Citations (91)
1