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Cornelia Jäger

Atotech

4

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Impact of Accelerator Decomposition Products to the Stability of TSV Filling Processes

2015
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Copper filling of TSVs for interposer applications

2012 EPTC | Electronics Packaging Technology Conference
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Filling TSV of different dimension using galvanic copper deposition

2011 IMPACT | International Microsystems, Packaging, Assembly and Circuits Technology Conference
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