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Dominik Truessel
Dominik Truessel
Electronic engineering
Engineering
Insulated-gate bipolar transistor
Electrical engineering
Power module
5
Papers
33
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MODULE À SEMI-CONDUCTEUR DE PUISSANCE
2018
Dominik Truessel
Samuel Hartmann
Fabian Fischer
Harald Beyer
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The 62Pak IGBT modules employing 1700V SPT++ chip set for 175°C operation
2016
Sven Matthias
Chiara Corvasce
Athanasios Mesemanolis
Martin J. Bayer
Emilia Gustafsson
Charalampos Papadopoulos
Arnost Kopta
Dominik Truessel
Raffael Schnell
Munaf Rahimo
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LinPak, a new low inductive phase-leg IGBT module with easy paralleling for high power density converter designs
2015
Raffael Schnell
Samuel Hartmann
Dominik Truessel
Fabian Fischer
Andreas Baschnagel
Munaf Rahimo
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Packaging Technology Platform for Next Generation High Power IGBT Modules
2014
Samuel Hartmann
Venkatesh Sivasubramaniam
David Guillon
David Hajas
Rolf Schuetz
Dominik Truessel
Charalampos Papadopoulos
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Citations (8)
A new HiPak Module Platform with Improved Reliability
2014
G. Paques
H. Beyer
R. Ehrbar
S. Ellenbroek
Fabian Fischer
S. Karadaghi
Sven Matthias
E. Oezkol
Dominik Truessel
Raffael Schnell
Arnost Kopta
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Citations (2)
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