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Athanasios Mesemanolis
Athanasios Mesemanolis
Electronic engineering
Insulated-gate bipolar transistor
Engineering
Electrical engineering
Chipset
4
Papers
3
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0
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An advanced soft punch through buffer design for thin wafer IGBTs targeting lower losses and higher operating temperatures up to 200 °C
2018
ISPSD | International Symposium on Power Semiconductor Devices and IC's
Elizabeth Buitrago
Athanasios Mesemanolis
Charalampos Papadopoulos
Chiara Corvasce
Jan Vobecky
Munaf Rahimo
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The 62Pak IGBT modules employing 1700V SPT++ chip set for 175°C operation
2016
Sven Matthias
Chiara Corvasce
Athanasios Mesemanolis
Martin J. Bayer
Emilia Gustafsson
Charalampos Papadopoulos
Arnost Kopta
Dominik Truessel
Raffael Schnell
Munaf Rahimo
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The 62Pak IGBT module range employing the 3rd Generation 1700V SPT++ chip set for 175 °C operation
2016
Sven Matthias
Chiara Corvasce
Athanasios Mesemanolis
Emilia Gustafsson
Charalampos Papadopoulos
Arnost Kopta
Silvan Geissmann
Martin J. Bayer
Raffael Schnell
Munaf Rahimo
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Βελτιστοποίηση συστημάτων ελέγχου ανεμογεννητριών για την αύξηση της απόδοσής τους
2014
Athanasios Mesemanolis
Αθανάσιος Μεσεμανώλης
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