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Michael Pinczolits
Michael Pinczolits
Infineon Technologies
Wafer dicing
Dicing tape
Wafer
Adhesive
Adhesion
3
Papers
1
Citations
0
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Optimum Chip-Tape Adhesion for Reliable Pickup Process
2017
IEEE Transactions on Components, Packaging and Manufacturing Technology
Marko Omazić
Daniel Tscharnuter
G. Oreski
Michael Pinczolits
Nika Nikac
Andreas Rappmund
Matko Erceg
Gerald Pinter
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Component and process for producing a component by means of an ultra-thin carrier
2013
Karl Mayer
Evelyn Napetschnig
Michael Pinczolits
Michael Sternad
Michael Rösner
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1