Component and process for producing a component by means of an ultra-thin carrier

A system and method for preparing a packaged component is disclosed. An embodiment includes forming a plurality of components on a support, wherein the plurality of components being spaced from each other by notch areas on a front side of the support, and forming a metal pattern on a backside of the support, wherein the metal pattern, the backside of the support with the exception covered by the notch areas corresponding areas. The method further includes creating the component, by separating it from the carrier.