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J.W. Hwang
J.W. Hwang
Samsung
Electronic engineering
Materials science
Interconnection
Dielectric
Immunology
5
Papers
11
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296 - Intracerebroventricular transplantation of human umbilical cord blood derived mesenchymal stem cells attenuates symptoms of repetitive mild traumatic brain injury (RM TBI)
2017
Cytotherapy
J.W. Hwang
Soo-Jin Choi
Wonil Oh
J. Chang
Duk L. Na
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High performance Cu/low-k interconnect strategy beyond 10nm logic technology
2015
IITC | International Interconnect Technology Conference
R.-H. Kim
Byung-hee Kim
Jinseok Kim
Jang-Hee Lee
Jongmin Baek
J.H. Hwang
J.W. Hwang
J. Chang
S.Y. Yoo
T. J. Yim
K.-M. Chung
Kang-Wook Park
T. Oszinda
I. S. Kim
E.B. Lee
Sang-don Nam
S. Jung
Y.W. Cho
Hyunjun Choi
Jang-ho Kim
Sanghoon Ahn
S. H. Park
B. U. Yoon
J.-H. Ku
S.S. Paak
Nae-in Lee
Seungwook Choi
H.K. Kang
Eunseung Jung
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Effect of mechanical strength and residual stress of dielectric capping layer on electromigration performance in Cu/low-k interconnects
2004
IEDM | International Electron Devices Meeting
Kwangseok Lee
Hong-jae Shin
Young Jin Wee
Tae Chan Kim
A.T. Kim
Jongpal Kim
Seungwook Choi
B.S. Suh
Sang-Cheol Lee
Ki Yeol Park
J.W. Hwang
Seok-Woo Nam
Y.J. Moon
J.E. Ku
Hyeon-deok Lee
M.Y. Kim
I.H. Oh
J.Y. Maeng
Il-Goo Kim
Jong-Gil Lee
A.M. Lee
Won Ho Choi
S. Park
Nae-in Lee
Hyon-Goo Kang
G.P. Suh
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Highly manufacturable Cu/low-k dual damascene process integration for 65nm technology node
2004
IITC | International Interconnect Technology Conference
K.-W. Lee
Hyun Jin Shin
J.W. Hwang
Seo-Woo Nam
Young-Joon Moon
Young Jin Wee
I.G. Kim
W.J. Park
Jae-Chul Kim
Seungmoo Lee
Kwang Myeon Park
H.K. Kang
Kwang Pyuk Suh
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A 7‐inch Full‐Color Low‐Temperature Poly‐Si TFT‐LCD
1999
H. J. Kim
D. Kim
J.H. Lee
I.G. Kim
G. S. Moon
J. H. Huh
J.W. Hwang
S. Y. Joo
K. W. Kim
Jun H. Souk
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Citations (9)
1