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XiangFu Zhao

Semiconductor Manufacturing International Corporation

6

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Reliability comparison between Al process and Cu process based on 0.11um technology node

2018 CSTIC | China Semiconductor Technology International Conference
- XiangFu Zhao
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Exploration of baking temperature effects on 28 nm BEOL reliability

2017 Microelectronics Reliability
- XiangFu Zhao
- Wei-Ting Kary Chien
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Exploration on electromigration short length effect of Low-K Cu interconnect

2016 CSTIC | China Semiconductor Technology International Conference
- XiangFu Zhao
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Uniformity impact on the upstream Electromigration of 40nm low-k Cu interconnect

2015 CSTIC | China Semiconductor Technology International Conference
- XiangFu Zhao
- Atman Zhao
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Effect of alloy seed on Cu interconnect electromigration and stress migration

2014 Microelectronic Engineering
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Mechanism exploration on Cu interconnect negative resistance shift during stress migration

2014 IRPS | International Reliability Physics Symposium
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