Old Web
English
Sign In
Acemap
>
authorDetail
>
Muhammad-Hassan Malik
Muhammad-Hassan Malik
Materials science
Nanotechnology
Electronics
Copper
Power module
3
Papers
2
Citations
0
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (3)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
ACF bonding technology for paper- and PET-based disposable flexible hybrid electronics
2021
Journal of Materials Science: Materials in Electronics
Dal-Jin Yoon
Muhammad-Hassan Malik
Pan Yan
Kyung-Wook Paik
Ali Roshanghias
Show All
Source
Cite
Save
Citations (2)
Evaluation of low cost sealing methods to protect sustainable printed temperature sensors against degradation due to UV irradiation
2021
SENSORS | IEEE Sensors
Lukas Rauter
Johanna Zikulnig
Muhammad-Hassan Malik
Sherjeel M. Khan
Lisa-Marie Faller
Hubert Zangl
Jürgen Kosel
Show All
Source
Cite
Save
Citations (0)
Sinterconnects: All-Copper Top-Side Interconnects Based on Copper Sinter Paste for Power Module Packaging
2021
Energies
Ali Roshanghias
Perla Malago
Jarosław Kaczyński
Timothy A. Polom
Jochen Bardong
Dominik Holzmann
Muhammad-Hassan Malik
Michael Ortner
Christina Hirschl
Alfred Binder
Show All
Source
Cite
Save
Citations (0)
1