Old Web
English
Sign In
Acemap
>
authorDetail
>
Dominik Holzmann
Dominik Holzmann
Metallurgy
Materials science
Optoelectronics
Level measurement
Electronic engineering
4
Papers
6
Citations
0.00
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (4)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
Sinterconnects: All-Copper Top-Side Interconnects Based on Copper Sinter Paste for Power Module Packaging
2021
Energies
Ali Roshanghias
Perla Malago
Jarosław Kaczyński
Timothy A. Polom
Jochen Bardong
Dominik Holzmann
Muhammad-Hassan Malik
Michael Ortner
Christina Hirschl
Alfred Binder
Show All
Source
Cite
Save
Citations (0)
Thermosonic fine-pitch flipchip bonding of silicon chips on screen printed paper and PET substrates
2020
Microelectronic Engineering
Ali Roshanghias
Augusto Daniel Rodrigues
Dominik Holzmann
Show All
Source
Cite
Save
Citations (6)
Miniaturized On-Chip NFC Antenna versus Screen-Printed Antenna for the Flexible Disposable Sensor Strips
2020
IOT | The Internet of Things
Atefeh Kordzadeh
Dominik Holzmann
Alfred Binder
Thomas Moldaschl
Johannes Sturm
Ali Roshanghias
Show All
Source
Cite
Save
Citations (0)
Evaluation of an indirect slag level measurement for liquid steel
2017
SENSORS | IEEE Sensors
Dominik Holzmann
Thomas Arnold
Show All
Source
Cite
Save
Citations (0)
1