Old Web
English
Sign In
Acemap
>
authorDetail
>
B. Jones
B. Jones
Freescale Semiconductor
Materials science
Wafer
Wafer bonding
Electronic engineering
Stacking
2
Papers
114
Citations
0.00
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (2)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
Challenges for 3D IC integration: bonding quality and thermal management
2007
IITC | International Interconnect Technology Conference
P. Leduca
F. De Crecy
M. Fayolle
Barbara Charlet
T. Enot
M. Zussy
B. Jones
Jean-Charles Barbe
N. Kernevez
Nicolas Sillon
Sylvain Maitrejean
D Louisa
Show All
Source
Cite
Save
Citations (80)
Three dimensional chip stacking using a wafer-to-wafer integration
2007
IITC | International Interconnect Technology Conference
Ritwik Chatterjee
M. Fayolle
P. Leduc
Scott K. Pozder
B. Jones
Eddie Acosta
Barbara Charlet
T. Enot
M. Heitzmann
M. Zussy
A. Roman
O. Louveau
Sylvain Maitrejean
D. Louis
N. Kernevez
Nicolas Sillon
G. Passemard
V. Po
Varughese Mathew
Sam S. Garcia
Terry G. Sparks
Zhihong Huang
Show All
Source
Cite
Save
Citations (34)
1