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Allan Beikmohamadi
Allan Beikmohamadi
Research Triangle Park
Materials science
Electronic engineering
Reflow soldering
Composite material
Soldering
3
Papers
8
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0
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Tacky Dots/sup TM/ transfer of solder spheres for flip chip and electronic package applications
1998
ECTC | Electronic Components and Technology Conference
Gregory B. Hotchkiss
Gonzalo Amador
L Jacobs
Roger J. Stierman
S. Dunford
Paul Hundt
Allan Beikmohamadi
Allan Cairncross
O. Gantzhorn
B. Quinn
M. Saltzberg
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Effect of post-reflow no-clean solder paste residue on electrical performance
1993
ECTC | Electronic Components and Technology Conference
Allan Beikmohamadi
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