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S. Dunford

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Design, fabrication, and reliability assessment of embedded resistors and capacitors on multilayered organic substrates

2005 APMPPI | International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces
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Intermetallic morphology and damage evolution under thermomechanical fatigue of lead (Pb)-free solder interconnections

2004 ECTC | Electronic Components and Technology Conference
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Tacky Dots/sup TM/ transfer of solder spheres for flip chip and electronic package applications

1998 ECTC | Electronic Components and Technology Conference
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Framatome in-core instrumentation improvements

1989 Transactions of the American Nuclear Society
- S. Dunford
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