author-photo

Yuichi Oda

6

Papers

8

Citations

Citation Trend

Filter By

Papers (5) Sort By

Journal Conference Others

Heat dissipative Pb-free bonding technology using Al-rich Zn/Al/Zn clad solder

2017 Welding International
Show All
- Source
- Cite
- Save
Citations (0)
Three-Layer Zn/Al/Zn Clad Solder for Die Attachment

2015 Journal of Electronic Materials
Show All
- Source
- Cite
- Save
Citations (5)
Effects of Bonding Conditions on Bondability Using Zn/Al/Zn Clad Solder

2015 Journal of Electronic Materials
Show All
- Source
- Cite
- Save
Citations (0)
Five layer Cu-coated Zn/Al clad solder for die attachment

2013
Show All
- Source
- Cite
- Save
Citations (0)
Matériau de jonction, procédé de fabrication associé et procédé de fabrication de structure de jonction

2011
Show All
- Source
- Cite
- Save
Citations (0)