Three-Layer Zn/Al/Zn Clad Solder for Die Attachment

Three-layer Zn/Al/Zn clad solders have been developed for high-temperature die attachment. The clad structure is used to improve the wettability and bondability of Zn-Al eutectic solder by preventing oxidation of the Al. The materials were produced by clad-rolling Zn and Al strips. TEM observations revealed that the Zn/Al clad interface was metallurgically bonded and that the Al oxide was almost entirely removed. The melting behavior of Zn/Al/Zn clad solder was examined. Eutectic melting began at the Zn/Al clad interface at 382°C, and all of the material melted within approximately 10 s. Unlike conventional Zn-Al solders, Zn/Al/Zn clad solders were successfully bonded without flux. The shear strength of a Zn/Al/Zn clad solder joint was three times that of a Pb-based solder joint. The bondability of Zn/Al/Zn clad solder was superior because the Al oxide films, which prevent bonding between chip and substrate, were fragmented by clad-rolling, and the outer Zn layers prevented Al oxidation during the bonding process.