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Tsung-Kuan Chou
Tsung-Kuan Chou
Intel
Materials science
Cantilever
CMOS
Electronic engineering
Soldering
7
Papers
46
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Application study of a novel micro gas chromatography and PTR-TOF-MS for on-site continuous ambient VOCs
2016
Wen-Tzu Liu
Wei-Cheng Liao
Jia-Lin Wang
Yan Horn Lin
Li Peng Wang
Tsung-Kuan Chou
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Nanochip: A MEMS-Based Ultra-High Data Density Memory Device
2010
Nickolai Belov
Donald Edward Adams
Peter David Ascanio
Tsung-Kuan Chou
John Heck
Byong-man Kim
Gordon Knight
Qing Ma
Jong-Seung Park
Valluri Rao
Robert N. Stark
Ghassan Tchelepi
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Pressure indicating film characterization of pressure distribution in eutectic Au/Sn wafer‐to‐wafer bonding
2010
Microelectronics International
D. Spicer
K. Lai
K. Kornelsen
A. Brennan
Nickolai Belov
M. Wang
Tsung-Kuan Chou
John Heck
Terry Zhu
S akhlaghi
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CMOS Compatible Poly-SiGe Cantilevers With Read/Write System For Probe Storage Device
2009
International Conference on Solid-State Sensors, Actuators and Microsystems
Simone Severi
John Heck
Tsung-Kuan Chou
Nickolai Belov
J.S. Park
D. Harra Ii
A. Jain
R Van Hoof
B. Du Bois
J. De Coster
O Varela
Myriam Willegems
Jan Vaes
Geraldine Jamieson
L. Haspeslagh
Donald Edward Adams
Rao
Stefaan Decoutere
Ann Witvrouw
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Thin-layer Au-Sn solder bonding process for wafer-level packaging, electrical interconnections and MEMS applications
2009
IITC | International Interconnect Technology Conference
Nickolai Belov
Tsung-Kuan Chou
John Heck
K. Kornelsen
D. Spicer
S akhlaghi
M. Wang
Terry Zhu
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Citations (26)
1