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Hsien-Wen Lujhou Hsu
Hsien-Wen Lujhou Hsu
Substrate (chemistry)
Materials science
Dielectric
dielectric layer
Chip
5
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2024
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Semiconductor package having a die receiving a continuous recess, and a connecting bore and a method for their preparation
2008
Hsien-Wen Lujhou Hsu
Diann-Fang Hukou Lin
Tung-Chuan Yangmei Wang
Wen-Kun Yang
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Chip self-redistribution device and method thereof
2008
Chih-Ming Sinpu Chen
Ming-Chung Fong Shan Cheng
Hsien-Wen Lujhou Hsu
Chih-Wei Gueiren Lin
Wen-Kun Yang
Chun Hui Yu
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