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Andy Bao
Andy Bao
Qualcomm
Electronic engineering
Composite material
Materials science
Dielectric
Soldering
4
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16
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Quantifying impact of design parameters on Ultra-Low k ILD reliability in fine pitch Cu bump interconnect structures
2015
ECTC | Electronic Components and Technology Conference
Andy Bao
Tong Cui
Ahmer Syed
Lily Zhao
Steve Bezuk
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The electromigration behavior of copper pillars for different current directions and pillar shapes
2015
IRPS | International Reliability Physics Symposium
Christine Hau-Riege
You-Wen Yau
Kevin Caffey
Rajneesh Kumar
Yangyang Sun
Andy Bao
Milind Pravin Shah
Lily Zhao
Omar James Bchir
Ahmer Syed
Steve Bezuk
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Challenges and opportunities of chip package interaction with fine pitch Cu pillar for 28nm
2014
ECTC | Electronic Components and Technology Conference
Andy Bao
Lily Zhao
Yangyang Sun
Michael Han
Geoffrey Yeap
Steve Bezuk
Pat Holmes
Cecille Alcira
Xuefeng Zhang
Kenny Lee
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Citations (12)
Chip Package Interaction with fine pitch Cu pillar bump using mass reflow and thermal compression bonding assembly process for 20nm/16nm and beyond
2014
VLSIT | Symposium on VLSI Technology
Lily Zhao
Andy Bao
Yangyang Sun
Chun-Jen Chen
Scott Tsai
Kenny Lee
Xuefeng Zhang
Dan Perry
Tor Kalleberg
Michael Han
Steve Bezuk
Geoffrey Yeap
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