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Pat Holmes
Pat Holmes
Qualcomm
Electronic engineering
Materials science
Composite material
Soldering
Flip chip
3
Papers
22
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Design and assembly process effects on lead free solder joint reliability of bare die and lidded flip chip ball grid array packages
2015
ECTC | Electronic Components and Technology Conference
Dongming He
Brian Roggeman
Eric Zhou
Jiantao Zheng
Pat Holmes
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Citations (2)
Challenges and opportunities of chip package interaction with fine pitch Cu pillar for 28nm
2014
ECTC | Electronic Components and Technology Conference
Andy Bao
Lily Zhao
Yangyang Sun
Michael Han
Geoffrey Yeap
Steve Bezuk
Pat Holmes
Cecille Alcira
Xuefeng Zhang
Kenny Lee
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Citations (12)
Flip Chip Package-in-Package (fcPiP): A New 3D Packaging Solution for Mobile Platforms
2007
ECTC | Electronic Components and Technology Conference
Raj Pendse
Bs Choi
Baker Kim
KyungOe Kim
Y.C. Kim
Kenny Lee
Susan Park
Dw Yang
Lily Zhao
Tom Gregorich
Pat Holmes
Ed Reyes
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Citations (8)
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