author-photo

Gong Yue Tang

Hong Kong University of Science and Technology

5

Papers

55

Citations

Citation Trend

Filter By

Papers (3) Sort By

Journal Conference Others

Integrated Liquid Cooling Systems for 3-D Stacked TSV Modules

2010 IEEE Transactions on Components and Packaging Technologies
Show All
- Source
- Cite
- Save
Citations (38)
Effects of TSV (Through Silicon Via) Interposer/Chip on the Thermal Performances of 3D IC Packaging

2009
Show All
- Source
- Cite
- Save
Citations (9)
Design and Analysis of 3D Stacked Optoelectronics on Optical Printed Circuit Boards

2008
Show All
- Source
- Cite
- Save
Citations (7)