Effects of TSV (Through Silicon Via) Interposer/Chip on the Thermal Performances of 3D IC Packaging

Thermal performances of 3D SiP (system-in-package) with TSV (through silicon via) interposer/chip are investigated based on heat-transfer CFD (computational fluid dynamic) analyses. Emphases are placed on the determination of (1) the equivalent thermal conductivity of interposers/chips with various copper-filled, aluminum-filled, and polymer w/o filler filled TSV diameters, pitches, and aspect ratios, and (2) the junction temperature and thermal resistance of 3D SiP with various TSV parameters. Useful design charts and guidelines are provided for engineering practice convenient.Copyright © 2009 by ASME