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Th. Laska
Th. Laska
Packaging engineering
Siemens
Electronic circuit
Power-system protection
Chip
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3/sup rd/ generation of 1200 V IGBT modules
1999
IAS | IEEE Industry Applications Society Annual Meeting
M. Hierholzer
Th. Laska
M. Loddenkotter
M. Münzer
Frank Pfirsch
Chris Schaffer
Th. Schmidt
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