Old Web
English
Sign In
Acemap
>
authorDetail
>
Suofanghong Bie
Suofanghong Bie
Rheology
Electrode
Toughness
Adhesive
Substrate (chemistry)
1
Papers
0
Citations
0
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (1)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
Semiconductor unit package, method and encapsulant for the packaging thereof
1996
mianwuheze
dalinxiaozhi
yingjingdu
harada juu
Suofanghong Bie
Show All
Source
Cite
Save
Citations (0)
1