Semiconductor unit package, method and encapsulant for the packaging thereof

A semiconductor unit package which comprises: a semiconductor element having electrode pads, the substrate having a terminal electrode, bump electrodes provided on a portion of the pad electrode, a conductive adhesive layer with toughness, a viscosity of 100Pa · s or less and a thixotropic index of 1.1 or less and a cured composition encapsulating layer. As a composition, for example, a resin binder and a substance filler polyepoxides, carboxylic anhydride, and a rheology modifier comprising as a main component, as a rheology modifier used is a carboxylic anhydride hindering the interaction between the functional substance in the free acid and polar groups on the surface of the filler material.