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Isamu Koshiyama
Isamu Koshiyama
Metallurgy
Composite material
Polishing
Tribology
Copper
6
Papers
100
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Comparison of copper disc and copper wafer polishing processes in terms of their kinetic, tribological, and thermal characteristics
2005
IEEE Transactions on Semiconductor Manufacturing
Z. Li
Paul Lefevre
Isamu Koshiyama
Katsuyoshi Ina
Duane S. Boning
Ara Philipossian
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Citations (6)
Characterizing recycled fumed silica slurries in ILD CMP applications
2005
MICRO | International Symposium on Microarchitecture
Ara Philipossian
Farhang Shadman
Patrick Lévy
Saied Tousi
Barry Gotlinsk
W. Scott Rader
Paul Lefevre
Isamu Koshiyama
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Polishing Measurement Using Geometrical Invariants
2005
Isamu Koshiyama
Tetsushi Senda
Haruo Masai
Charles Poutasse
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Determining the Effects of Slurry Surfactant, Abrasive Size, and Abrasive Content on the Tribology and Kinetics of Copper CMP
2005
Journal of The Electrochemical Society
Z. Li
Katsuyoshi Ina
Paul Lefevre
Isamu Koshiyama
Ara Philipossian
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Citations (50)
Effect of Slurry Flow Rate on Tribological, Thermal, and Removal Rate Attributes of Copper CMP
2004
Journal of The Electrochemical Society
Z. Li
Leonard Borucki
Isamu Koshiyama
Ara Philipossian
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Citations (44)
Mechanical-Chemical Polishing Method For Metal Materials
2004
Isamu Koshiyama
Hiroyuki Nakagawa
Tetsushi Senda
Sachiko Hoshiya
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