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Xiujitong Gu
Xiujitong Gu
Materials science
Epoxy
Semiconductor device
Softening point
Melting point
4
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Composition for interlayer filler of layered semiconductor device, layered semiconductor device, and method for manufacturing layered semiconductor device
2014
masaya sugiyama
kawase yasuhiro
Chiben Shen
Xiujitong Gu
yamazaki masanori
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Boron nitride agglomerated particles, compositions containing boron nitride agglomerated particles, and three-dimensional integrated circuit having a layer comprising the composition
2014
yamazaki masanori
masanori yamazaki
yasunori matusita
Xiujitong Gu
kawase yasuhiro
yasuhiro kawase
Chiben Shen
tomohide murase
mari abe
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Particules de nitrure de bore agrégées, composition contenant lesdites particules et circuit intégré à trois dimensions ayant une couche comprenant ladite composition
2012
yamazaki masanori
mari abe
tomohide murase
kawase yasuhiro
Chiben Shen
Xiujitong Gu
yasunori matusita
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Development of heat spreading measurement system by spot heating using thermoreflectance probing technique
2010
syakawato firozu
kisi yagi
naoyuki taketosi
yasunori matusita
chunnaben
Xiujitong Gu
tetuya baba
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