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Jennifer Oakley
Jennifer Oakley
IBM
Electronic engineering
Engineering
Through-silicon via
Electromigration
Copper interconnect
5
Papers
12
Citations
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Effect of Degraded Additives on Under-Fill TSV
2016
Shafaat Ahmed
Paul Findeis
Connie Nga Troung
Tien Jen Cheng
Stephan Grunow
Ronald Rothkranz
Jennifer Oakley
Troy L. Graves-Abe
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Vertical channel devices enabled by through silicon via (TSV) technologies
2016
International Electron Devices Meeting
Chandrasekharan Kothandaraman
Sami Rosenblatt
John M. Safran
Philip J. Oldiges
P Kulkarni-Kerber
J Xumalo
William F. Landers
Jinping Liu
Jennifer Oakley
S Butt
Troy L. Graves-Abe
Norman Robson
Mukta G. Farooq
Daniel George Berger
Subramanian S. Iyer
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Impact of 3D copper TSV integration on 32SOI FEOL and BEOL reliability
2015
IRPS | International Reliability Physics Symposium
Mukta G. Farooq
G. La Rosa
Fen Chen
Prakash Periasamy
Troy L. Graves-Abe
Chandrasekharan Kothandaraman
Christopher N. Collins
William F. Landers
Jennifer Oakley
Jin Liu
John M. Safran
S. Ghosh
Steven W. Mittl
Dimitris P. Ioannou
Carole Graas
Daniel George Berger
Subramanian S. Iyer
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Through silicon via (TSV) effects on devices in close proximity - the role of mobile ion penetration - characterization and mitigation
2014
IEDM | International Electron Devices Meeting
Chandrasekharan Kothandaraman
S. Cohen
Christopher Parks
John Golz
K. Tunga
Sami Rosenblatt
John M. Safran
Christopher N. Collins
William F. Landers
Jennifer Oakley
J. Liu
Andrew J. Martin
Kevin S. Petrarca
Mukta G. Farooq
Troy L. Graves-Abe
Norman Robson
S. S. Iyer
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Citations (5)
A study of via depletion electromigration with very long failure times
2011
IRPS | International Reliability Physics Symposium
Baozhen Li
Cathryn Christiansen
Kaushik Chanda
Matt Angyal
Jennifer Oakley
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Citations (3)
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