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J Xumalo
J Xumalo
GlobalFoundries
Through-silicon via
Communication channel
vertical channel
Electrical engineering
Computer engineering
3
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Vertical channel devices enabled by through silicon via (TSV) technologies
2016
IEDM | International Electron Devices Meeting
Chandrasekharan Kothandaraman
Sami Rosenblatt
J. Safran
Philip J. Oldiges
P Kulkarni-Kerber
J Xumalo
William F. Landers
Jinping Liu
J. A. Oakley
S Butt
Troy L. Graves-Abe
Norman Robson
Mukta G. Farooq
Daniel George Berger
Subramanian S. Iyer
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(TSV)技術によるによるシリコンにより可能になった垂直チャネルデバイス【Powered by NICT】
2016
Chandrasekharan Kothandaraman
Sami Rosenblatt
J Safran
Philip J. Oldiges
P Kulkarni-Kerber
J Xumalo
William F. Landers
Jinping Liu
J A Oakley
S Butt
Troy L. Graves-Abe
Norman Robson
Mukta G. Farooq
Daniel George Berger
Subramanian S. Iyer
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Vertical channel devices enabled by through silicon via (TSV) technologies
2016
International Electron Devices Meeting
Chandrasekharan Kothandaraman
Sami Rosenblatt
John M. Safran
Philip J. Oldiges
P Kulkarni-Kerber
J Xumalo
William F. Landers
Jinping Liu
Jennifer Oakley
S Butt
Troy L. Graves-Abe
Norman Robson
Mukta G. Farooq
Daniel George Berger
Subramanian S. Iyer
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Cite
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Citations (0)
1