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R. Ravikumar

Infineon Technologies

6

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17

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New Aqueous Clean for Aluminum Interconnects: Part I. Fundamentals

2001 Solid State Phenomena
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Al deposition temperature process window for 0.20 /spl mu/m Al RIE interconnections

1999 IITC | International Interconnect Technology Conference
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Cleans for Al vias in a 0.175 /spl mu/m dual damascene process

1999 IITC | International Interconnect Technology Conference
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