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D. Laviale
D. Laviale
CNET
Thermal stability
Copper
Composite material
Materials science
Dielectric
5
Papers
45
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LOW PRESSURE MICROWAVE ELECTRON CYCLOTRON RESONANCE PLASMA DEPOSITION OF AMORPHOUS TA2O5 FILMS
1994
Applied Physics Letters
D. Laviale
J.C. Oberlin
R.A.B. Devine
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Citations (44)
Fabrication d'un réseau d'interconnexions haute densité pour modules avancés multi-puces par une technique de lift-off
1993
Journal De Physique Iii
J. Palleau
D. Jourdain
J.C. Oberlin
M. Alaimo
G. Argoud
D. Aubert
M. Beudon
M. J. Bouzid
D. Laviale
F. Templier
J. Torres
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Study of physicochemical stability of the copper/polyphenylquinoxaline interfaces
1991
Ruhama Even
Jean Palleau
Jean C. Oberlin
R. Pantel
D. Laviale
François Templier
Juan Carlos Torres
R. Giustiniani
A. Cros
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Study of physicochemical stability of the copper/polyphenylquinoxaline interfaces
1991
R. Even
J. Palleau
J.C. Oberlin
R. Pantel
D. Laviale
François Templier
J. Torres
R. Giustiniani
A. Cros
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Physiochemical stability of copper/polyphenylquinoxaline interfaces
1990
R. Even
J. Palleau
J.C. Oberlin
R. Pantel
D. Laviale
F. Templier
Juan Carlos Torres
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