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Study of physicochemical stability of the copper/polyphenylquinoxaline interfaces
Study of physicochemical stability of the copper/polyphenylquinoxaline interfaces
1991
R. Even
J. Palleau
J.C. Oberlin
R. Pantel
D. Laviale
François Templier
J. Torres
R. Giustiniani
A. Cros
Keywords:
Materials science
Thermal stability
Composite material
Electronic packaging
Metallic bonding
Thin film
Dielectric
Annealing (metallurgy)
Copper
Correction
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