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Bertheau Julien
Bertheau Julien
Fan-out
Compression molding
Wafer-level packaging
Mechanical engineering
Materials science
2
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2
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Development of compression molding process for Fan-Out wafer level packaging
2020
ECTC | Electronic Components and Technology Conference
Bertheau Julien
Duval Fabrice F.C
Kubota Tadashi
Bex Pieter
Kennes Koen
Phommahaxay Alain
Podpod Arnita
Beyne Eric
Miller Andy
Beyer Gerald
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熱圧縮結合とウエハレベルアンダーフィルを用いた3次元IC組立品質改善とスループット向上のための戦略【Powered by NICT】
2016
Wang Teng
Bex Pieter
Capuz Giovanni
Duval Fabrice
Inoue Fumihiro
Gerets Carine
Bertheau Julien
Rebibis Kenneth June
Miller Andy
Beyer Gerald
Beyne Eric
Natsukawa Masanori
Mitsukura Kazuyuki
Hatakeyama Keiichi
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