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Phommahaxay Alain
Phommahaxay Alain
Materials science
Nanotechnology
Composite material
Aerospace engineering
Analytical chemistry
4
Papers
2
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0
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Development of compression molding process for Fan-Out wafer level packaging
2020
ECTC | Electronic Components and Technology Conference
Bertheau Julien
Duval Fabrice F.C
Kubota Tadashi
Bex Pieter
Kennes Koen
Phommahaxay Alain
Podpod Arnita
Beyne Eric
Miller Andy
Beyer Gerald
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表面活性化誘電体接着ウエハのためのエッジトリミング【Powered by NICT】
2017
Microelectronic Engineering
Inoue Fumihiro
Jourdain Anne
Visker Jakob
Peng Lan
Moeller Berthold
Yokoyama Kaori
Phommahaxay Alain
Rebibis Kenneth June
Miller Andy
Beyne Eric
Sleeckx Erik
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(サブ)表面欠陥に及ぼすSiウエハ薄化過程の影響【Powered by NICT】
2017
Applied Surface Science
Inoue Fumihiro
Jourdain Anne
Peng Lan
Phommahaxay Alain
De Vos Joeri
Rebibis Kenneth June
Miller Andy
Sleeckx Erik
Beyne Eric
Uedono Akira
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3D応用のための一時ウエハボンディングとデボンディングにおけるウエハBOND HT‐10.10からゾーンBOND材料への移行に関する集積化と製造視点
2013
ECTC | Electronic Components and Technology Conference
Jourdain Anne
Phommahaxay Alain
Verbinnen Greet
Murdoch Gayle
Miller Andy
Rebibis Kenneth
Guerrero Alice
Mccutcheon Jeremy
Privett Mark
Neidrich Jason
Beyer Gerald
Beyne Eric
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