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F. Dettoni
F. Dettoni
STMicroelectronics
Materials science
Wafer
Nanotechnology
Analytical chemistry
Optics
5
Papers
9
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Scanning Acoustic Microscopy versus Colored Picosecond Acoustics to detect interface defects in hybrid wafer bonding
2020
Solene Bossut
Arnaud Devos
Sandrine Lhostis
E. Deloffre
C Euvrard
F. Dettoni
C. Chaton
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High resolution nanotopography characterization at die scale of 28nm FDSOI CMOS front-end CMP processes
2014
Microelectronic Engineering
F. Dettoni
Maurice Rivoire
S. Gaillard
O. Hinsinger
F. Bertin
C Beitia
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Slurry selectivity influence on STI and POP processes for RMG application
2012
Catherine Euvrard
C. Perrot
A. Seignard
F. Dettoni
Maurice Rivoire
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Haze used as wafer, die and intra-die indirect characterization technique for advanced CMP processes on patterned wafers
2012
F. Dettoni
C Beitia
Catherine Euvrard
Y. Morand
S. Gaillard
O. Hinsinger
F. Bertin
Maurice Rivoire
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Interferometry: a direct die level characterization technique
2012
F. Dettoni
C Beitia
Y. Morand
Catherine Euvrard
V. Balan
J. Peak
S. Gaillard
O. Hinsinger
F. Bertin
Maurice Rivoire
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