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Haze used as wafer, die and intra-die indirect characterization technique for advanced CMP processes on patterned wafers
Haze used as wafer, die and intra-die indirect characterization technique for advanced CMP processes on patterned wafers
2012
F. Dettoni
C Beitia
Catherine Euvrard
Y. Morand
S. Gaillard
O. Hinsinger
F. Bertin
Maurice Rivoire
Keywords:
Haze
Wafer
Electronic engineering
Materials science
Composite material
Nanotechnology
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