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Gyu-Tae Park
Gyu-Tae Park
Amkor Technology
Electromigration
Materials science
Composite material
Intermetallic
Current density
6
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18
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Effect of Electromigration-Induced Joule Heating on the Reliability of Sn-Ag Microbump with Different UBM Structures
2020
Journal of Electronic Materials
Kirak Son
Gyu-Tae Park
Byeong-Rok Lee
Cheol-Woong Yang
Jeong Sam Han
Tae-Kyu Lee
Young-Bae Park
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Citations (2)
Volume Shrinkage-Induced Voiding Mechanism During Electromigration of Cu/Ni/Sn–Ag Microbump
2020
Journal of Nanoscience and Nanotechnology
Kirak Son
Gyu-Tae Park
Byeong-Rok Lee
Young-Bae Park
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Citations (2)
Ni Barrier Symmetry Effect on Electromigration Failure Mechanism of Cu/Sn–Ag Microbump
2019
Electronic Materials Letters
Gyu-Tae Park
Byeong-Rok Lee
Kirak Son
Young-Bae Park
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Citations (9)
Effects of NCF and UBM Materials on Electromigration Reliabilities of Sn-Ag Microbumps for Advanced 3D Packaging
2019
ECTC | Electronic Components and Technology Conference
Kirak Son
Gahui Kim
Hyodong Ryu
Gyu-Tae Park
Ho-Young Son
Nam-Seog Kim
Cheol-Woong Yang
Young-Cheon Kim
Jeong Sam Han
Young-Bae Park
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Citations (2)
Effect of Current Densities on the Electromigration Failure Mechanisms of Flip-Chip Sn-Ag Solder Bump
2017
Korean Journal of Metals and Materials
Gahui Kim
Kirak Son
Gyu-Tae Park
Young-Bae Park
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Citations (3)
Effects of PCB Surface Finishes on in-situ Intermetallics Growth and Electromigration Characteristics of Sn-3.0Ag-0.5Cu Pb-free Solder Joints
2015
Sung-Hyuk Kim
Gyu-Tae Park
Byeong-Rok Lee
Jae-Myeong Kim
Sehoon Yoo
Young-Bae Park
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