Old Web
English
Sign In
Acemap
>
Paper
>
Effect of Current Densities on the Electromigration Failure Mechanisms of Flip-Chip Sn-Ag Solder Bump
Effect of Current Densities on the Electromigration Failure Mechanisms of Flip-Chip Sn-Ag Solder Bump
2017
Gahui Kim
Kirak Son
Gyu-Tae Park
Young-Bae Park
Keywords:
Metallurgy
Composite material
Electromigration
Soldering
Materials science
Flip chip
Correction
Cite
Save
Machine Reading By IdeaReader
0
References
3
Citations
NaN
KQI
[]