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Norio Kainuma
Norio Kainuma
Fujitsu
Electronic engineering
Materials science
Chip
Stacking
Flip chip
5
Papers
2
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0
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2024
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Assembly Process Development of Ultra Large Scale 3D Stacking with Transmission Circuits Via TSVs
2018
ECTC | Electronic Components and Technology Conference
Shunichi Kikuchi
Hidehiko Kira
Makoto Suwada
Tatsumi Nakada
Naoaki Nakamura
Norio Kainuma
Kazuhiro Kanai
Takumi Masuyama
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Development of high-performance ultra large scale 3D processor with high reliability packaging design
2017
IMPACT | International Microsystems, Packaging, Assembly and Circuits Technology Conference
Shinji Tadaki
Hideki Kitada
Aki Dote
Shouichi Miyahara
Takumi Masuyama
Norio Kainuma
Naoaki Nakamura
Hidehiko Kira
Seiki Sakuyama
Tatsumi Nakata
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Development of a stacking technology for large-sized chips using non-conductive film
2016
ICSJ | CPMT Symposium Japan
Hidehiko Kira
Norio Kainuma
Naoaki Nakamura
Takashi Kubota
Takumi Masuyama
Sanae Iijima
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Head suspension assembly method and disk device
2000
Akio Gouo
Norio Kainuma
Hidehiko Kawasaki Kira
Takeshi Kawasaki Ohwe
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Assembling method for a semiconductor device
1998
Kazuhisa Tsunoi
Hidehiko Kira
Shunji Baba
Akira Fujii
Toshihiro Kusagaya
Kenji Kobae
Norio Kainuma
Naoki Ishikawa
Satoshi Emoto
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