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G. Endo
G. Endo
Fujitsu
Chip-scale package
Packaging engineering
Chip
Miniaturization
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Realization of small and low profile Duplexer using a CSSD packaging technology
2009
IUS | Internaltional Ultrasonics Symposium
Toshio Nishizawa
G. Endo
Motoyuki Tajima
S. Ono
Osamu Kawachi
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Citations (7)
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